The semiconductor manufacturing equipment market is set to undergo rapid transformation in the next several years. Chipmakers worldwide are witnessing demand for memory ICs such as SRAM, DRAM, and MRAM in gaming and entertainment applications. These chips are used in most gaming hardware in use today to improve graphics and deliver lag-free gaming experience. According to the nonprofit organization UKIE, the U.K. witnessed gaming console sales worth US$1,037 billion in 2020, a staggering 74.8% increase compared to the previous year.
The fast-growing trend of electric and hybrid vehicles is also opening up promising opportunities for the semiconductor manufacturing equipment industry. EVs are packed with electronics and semiconductor components such as sensors, system-on-chips (SoCs), microprocessors, and others. Continuous advances in chip design to increase safety and improve connectivity will benefit chipmakers across the world.
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In terms of annual revenue, the global semiconductor manufacturing equipment market size is projected to be worth US$90 billion by the year 2027. Future trends in the industry will revolve around the miniaturization of chip size and implementation of create semiconductor architecture.
The application of polishing and grinding processes in the production of chipsets, MEMS sensors, ICs, and optics is expanding continuously. The need for miniaturization of electronics components regular polishing and grinding in order to minimize subsurface damage and maintain wafer flexibility. In 2020, polishing and grinding equipment held over 3% of the overall market share and its demand could rise at over 5% in the coming years.
In anticipation of this demand, chipmakers are rolling out new solutions in the market. for instance, AMC Research Inc. launched Ultra Stress-Free Polishing (SFP) tool in March last year. Designed for advanced semiconductor packaging and wafer processing, the tool helps chipmakers improve wafer processing and cut operational costs.
In terms of dimension, the 2D segment captured about 30% of the semiconductor manufacturing equipment market in 2020 and could expand at more than 6% CAGR in the future. 2D architecture offers numerous benefits including low-cost operation, lower power consumption, and a robust built. Various electronics companies and research institutes are collaborating to design 2D material-based ICs. In May, for example, TSMC had partnered with MIT and the National Institute of Taiwan (NTU) for the development of 1 nm chips.
Europe semiconductor manufacturing equipment market size is slated to expand at over 4.5% CAGR up to 2027. The regional market is driven by government investments and initiatives to accelerate local chip production. in March this year, for instance, the European Union announced plans to boost chip production capacity by 20% by the year 2030. As part of this commitment, EU invested USD 160 billion in semiconductor production and supply chain infrastructure. The region is also witnessing collaborations among various chipmakers. Citing an example, in April last year, STMicroelectronics collaborated with Huawei to develop fabricated chips for the automotive sector.
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Some of the notable companies in the semiconductor manufacturing equipment market include Applied Materials Inc., Nordson Corporation, ASML Holdings N.V., Veeco Instruments Inc., Micron Technology Inc., and Intel Corporation to name a few. The market players are focusing on new product development and other strategies to gain a competitive edge. For instance, in December last year, Advantest Corporation introduced two general-purpose hardware equipment and power supply modules to advance the capabilities of its T2000 test platform.
Table of Contents (ToC) of the report:
Chapter 1 Methodology and Scope
1.1 Scope & definition
1.2 Methodology & forecast
1.3 Data Sources
Chapter 2 Executive Summary
2.1 Semiconductor manufacturing equipment market 3600 synopsis, 2016 - 2027
2.1.1 Business trends
2.1.2 Regional trends
2.1.3 Product trends
2.1.4 Dimension trends
2.1.5 Supply chain process
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